(module HVQFN33-0.5mm (layer F.Cu) (tedit 54F64AC8)
  (solder_paste_margin -0.05)
  (clearance 0.1)
  (fp_text reference HVQFN33-0.5mm (at 0.08636 3.91668) (layer F.SilkS) hide
    (effects (font (size 0.7 0.6) (thickness 0.11)))
  )
  (fp_text value VAL** (at 0.0508 -3.81762) (layer F.SilkS)
    (effects (font (size 0.7 0.6) (thickness 0.11)))
  )
  (fp_circle (center -2.70256 -2.70256) (end -2.43332 -2.42062) (layer F.SilkS) (width 0.22098))
  (fp_line (start -2.75 2.75) (end -2.2 2.75) (layer F.SilkS) (width 0.22098))
  (fp_line (start -2.75 2.75046) (end -2.75 2.20046) (layer F.SilkS) (width 0.22098))
  (fp_line (start 2.7491 2.74792) (end 2.7491 2.19792) (layer F.SilkS) (width 0.22098))
  (fp_line (start 2.2 2.75) (end 2.75 2.75) (layer F.SilkS) (width 0.22098))
  (fp_line (start 2.2 -2.75) (end 2.75 -2.75) (layer F.SilkS) (width 0.22098))
  (fp_line (start 2.75164 -2.2) (end 2.75164 -2.75) (layer F.SilkS) (width 0.22098))
  (fp_line (start -2.75 -2.2) (end -2.75 -2.75) (layer F.SilkS) (width 0.22098))
  (fp_line (start -2.75 -2.75) (end -2.2 -2.75) (layer F.SilkS) (width 0.22098))
  (pad 33 thru_hole circle (at 0 0) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 33 thru_hole circle (at -0.8 -0.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 33 thru_hole circle (at 0.8 -0.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 33 thru_hole circle (at 0.8 0.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 16 smd rect (at 1.75 2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 0.75 2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 1.25 2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at -0.75 2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at -1.25 2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 0.25 2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at -0.25 2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -1.75 2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 32 smd rect (at -1.75 -2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 29 smd rect (at -0.25 -2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 28 smd rect (at 0.25 -2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 31 smd rect (at -1.25 -2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 30 smd rect (at -0.75 -2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 26 smd rect (at 1.25 -2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 27 smd rect (at 0.75 -2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 25 smd rect (at 1.75 -2.625 90) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 24 smd rect (at 2.625 -1.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at 2.625 0.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 23 smd rect (at 2.625 -1.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 22 smd rect (at 2.625 -0.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 2.625 1.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at 2.625 0.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 2.625 1.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -2.625 1.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -2.625 0.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -2.625 1.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.625 -0.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.625 -1.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.625 0.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.625 -0.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -2.625 -1.75) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 33 thru_hole circle (at -0.8 0.8) (size 0.6 0.6) (drill 0.3) (layers *.Cu))
  (pad 21 smd rect (at 2.625 -0.25) (size 0.85 0.27) (layers F.Cu F.Paste F.Mask))
  (pad 33 smd rect (at 0 0) (size 2 2) (layers F.Cu F.Paste F.Mask))
)